In reflow soldering, soldering paste is applied under pressure to the circuit board. As the applied solder has adhesive properties, the circuit board can be assembled without any further fixation, and can then pass through the furnace. After a pre-heating phase, the solder is heated to fusion temperature during the soldering phase. At this temperature, the solder becomes liquid, and this creates a bond between the component and circuit board. The result is a fault-free solder connection after the solder has cooled.
Below we recommend the soldering temperature profiles for reflow soldering process. Please note that these is only recommended profile, because it is not possible to list general parameters for different procedures, circuit boards and components. A soldering profile which produces optimal results must be calculated on an individual basis.